Optimization of a Mechanical Bridge Joint Structure in a Stacked HTS Conductor

Optimization of a Mechanical Bridge Joint Structure in a Stacked HTS Conductor
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堆叠式高温超导导体中机械桥接头结构的优化

DOI:
10.1109/tasc.2013.2239335
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发表时间:
2013
影响因子:
1.8
通讯作者:
K. Kawai
K. Kawai
中科院分区:
物理与天体物理3区
文献类型:
--
作者:
Makihara;K.;Kuroishi;C.;and Fukunaga;H;K. Kawai

文献摘要

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本文研究了高温超导磁体“可拆装”或分段制造时叠层高温超导导体的机械桥式搭接。在以前的研究中,联合的电阻率进行了评估实验的单层和双层堆叠的GdBCO涂层导体的桥接接头。然而,由于接头区域中的间隙或未对准引起的不均匀的接触压力分布,接头电阻率随着层数的增加而增加。因此,在本研究中,我们的目标是通过实现更均匀的接触压力分布来降低接头阻力。此外,我们研究了温度的影响,同时施加压力的关节和定位的关节结构,以研究其在实际的大尺寸磁体的应用。首先,我们在接合面之间插入铟膜,以使接触压力均匀。实验结果表明,与铟膜的联合电阻率不依赖于层数。此外,在室温下施力比在77 K下施力更能有效地降低接头电阻率。最后,我们检查了螺栓拧紧的连接结构的效果。结果表明,凸板结构具有较好的连接性能。
The mechanical bridge joint (bridge-type lap joint) of a stacked high-temperature superconducting conductor has been investigated for a “remountable” or a segment-fabricated high-temperature superconducting magnet. In a previous study, joint resistivities were evaluated experimentally for the bridge joints of single-layer and double-layer stacked GdBCO coated conductors. However, the joint resistivity increased with an increase in the number of layers due to nonuniform contact pressure distribution caused by a gap or misalignment in the joint region. In this study, therefore, we were aiming at the reduction of joint resistance by achieving more uniform contact pressure distribution. In addition, we investigated the effects of temperature while applying pressure to the joint and positioning the joint structure to investigate its application in an actual large-sized magnet. First, we inserted an indium film between the joint surfaces to make contact pressure uniform. Experimental results showed that joint resistivity with the indium film did not depend on the number of layers. In addition, applying force at room temperature was more effective in decreasing joint resistivity than that at 77 K. Finally, we examined the effect of the joint structure with screw bolt tightening. The result showed that the structure of the convex plate has better joint performance than others.