Observation of recrystallization upon annealing rapidly solidified microstructures of highly undercooled Ni80Cu20 alloys
Observation of recrystallization upon annealing rapidly solidified microstructures of highly undercooled Ni80Cu20 alloys
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DOI：
10.1016/j.jallcom.2014.01.228
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发表时间：
2014-06
影响因子：
6.2
通讯作者：
Xinming Xu;F. Liu
中科院分区：
文献类型：
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作者：
Xinming Xu;F. Liu
实验观察到了快速凝固组织中的再结晶现象。用Ga-In合金液对深过冷Ni 80 Cu 20合金进行了快速凝固前的淬火处理。淬火后，获得部分再结晶组织。此外，还观察到诸如位错网络的致密晶体缺陷。进一步退火的部分再结晶组织产生更高程度的再结晶组织。这些直接观察到的实验结果，一个最有可能的潜在的物理起源，即应力诱导再结晶机制，在快速凝固组织中发生在高过冷度制度的晶粒细化现象是澄清。
Recrystallization in rapidly solidified microstructures was experimentally observed. Highly undercooled Ni80Cu20alloy melts were quenched before rapid solidification by Ga–In liquid alloy. After the quenching, partially recrystallized microstructures were obtained. In addition, dense crystalline defects such as dislocation networks were also observed. Further annealing of the partially recrystallized microstructures produced higher degree of recrystallization microstructures. With these directly observed experimental results, one of the most probable underlying physical origins, i.e. stress induced recrystallization mechanism, of the grain refinement phenomenon occurring at high undercooling regimes in rapidly solidified microstructures is clarified.