Micro Dimple Fabrication on OFHC Copper by Laser Shock Processing
Micro Dimple Fabrication on OFHC Copper by Laser Shock Processing
复制标题
通过激光冲击加工在 OFHC 铜上制造微凹坑
DOI：
10.4028/www.scientific.net/amm.217-219.2246
复制
发表时间：
2012-11
期刊：
影响因子：
--
通讯作者：
Zhenqiang Yao
中科院分区：
文献类型：
--
作者：
Kangmei Li;Yongxiang Hu;Zhenqiang Yao
微凹窝通常被认为是一种有价值的织构，它可以作为润滑剂和磨屑的储存器，改善滑动表面的润滑和减少磨损。激光冲击加工（LSP）是一种新颖的表面处理技术，它可以对金属进行修饰，精确地塑造金属零件的形状。本文提出了一种基于LSP的微韧窝加工新工艺——激光喷磨（LPT）。对无氧高导电性（OFHC）铜进行了LPT实验。研究了实验参数对微凹窝几何特性的影响。结果表明，LPT后，凹窝周围会产生堆积。微凹窝的直径、深度和纵横比随着激光功率密度和重复激波次数的增加而增大，但都逐渐趋于饱和。从显微分析来看，韧窝下方有明显的晶粒细化。
Micro dimples have been generally considered as a valuable texture which can improve lubrication and reduce wear of the sliding surfaces by acting as reservoirs of lubricants and grinding debris. Laser shock processing (LSP) is an innovative surface treatment technology which can modify metals and shape metallic parts accurately. In this study, a new process for micro dimple fabrication which could be called laser peen texturing (LPT) was proposed based on LSP. LPT experiments were performed on Oxygen-Free High Conductivity (OFHC) copper. Influences of experimental parameters on geometrical characteristics of micro dimples were investigated. It was found that after LPT, the pile up was generated around the dimple .The diameter, depth and aspect ratio of the micro dimples increase with the laser power density and repeated shock number, but all of them saturated gradually. From matellographic analysis, grain refinement was observed obviously beneath the dimple.
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