Removal and Preparation of Electrodeposited Semiconductors for High Impedance Hall Effect Measurements
Removal and Preparation of Electrodeposited Semiconductors for High Impedance Hall Effect Measurements
复制标题
用于高阻抗霍尔效应测量的电解沉积半导体的去除和制备
DOI:
10.1149/1.2085430
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发表时间:
1991
影响因子:
3.9
通讯作者:
M. Cocivera
中科院分区:
文献类型:
--
作者:
J. Windheim;H. Wynands;M. Cocivera
The preparation of electrodeposited semiconductors for Hall effect measurements is complicated by the fact that these materials are, by necessity, attached to highly conducting substrates. As a result, methods were developed to reproducibly remove large area samples from their conducting substrates, and suitably prepared samples were used for temperature‐dependent Hall measurements and resistivity measurements. Apparatus was designed and built to routinely measure Hall voltages as low as 250 μV for source impedances up to 1012 Ω using films about 1 μm in thickness. Measurements were performed on numerous electrodeposited materials: , , , and . Argon annealed electrodeposited was found to be consistently p‐type, with resistivity values typically 106–107 Ω cm p → n conversion of was achieved by diffusion of Cd at high temperature. was also p‐type, but had much lower resistivity and higher carrier concentration than . and were both n‐type with carrier concentrations typically 1016 cm−3 and 1014–1016 cm−3, respectively.