Suppression of persistent slip band growth in polycrystalline copper by applying high-density electropulsing and its evaluation
Suppression of persistent slip band growth in polycrystalline copper by applying high-density electropulsing and its evaluation
复制标题
高密度电脉冲抑制多晶铜中持续滑移带生长及其评价
DOI：
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发表时间：
2022
期刊：
影响因子：
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通讯作者：
Hiroyuki Kawada
中科院分区：
文献类型：
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作者：
Haruka Sasa;Jeehwan Shin;Atsushi Hosoi;Makoto Kitano;Hiroyuki Kawada
