Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders
Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders
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DOI：
10.1007/s11664-012-2086-6
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发表时间：
2012-04
影响因子：
2.1
通讯作者：
A. Roshanghias;A. Kokabi;Y. Miyashita;Y. Mutoh;I. Ihara;R. G. Guan Fatt;H. Madaah-Hosseini
中科院分区：
文献类型：
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作者：
A. Roshanghias;A. Kokabi;Y. Miyashita;Y. Mutoh;I. Ihara;R. G. Guan Fatt;H. Madaah-Hosseini
高密度、超小间距的电子应用需要具有改进的热机械性能的小型化焊料凸块。此外，需要能够精确地表征这些焊料凸点的新技术。满足这两个要求的一种方法是利用最近开发的具有增强的抗蠕变性的纳米复合焊料，并使用纳米压痕技术来表征这些焊料。在本研究中，二氧化铈增强的纳米复合焊料箔的累积轧制工艺制造的蠕变行为，其特征在于使用深度传感纳米压痕技术。结果表明，复合材料的抗蠕变性能随CeO2增强体体积分数的增加而提高，推测该复合材料的蠕变变形是通过基体的变形实现的，增强体的作用是通过降低作用在基体上的有效应力来提高抗蠕变性能。蠕变指数的值表明，所涉及的主要蠕变变形机制是扩散蠕变和晶界滑动。
High-density, ultrasmall-pitch electronic applications require miniaturized solder bumps with improved thermomechanical performance. In addition, novel techniques which are able to precisely characterize these solder bumps are needed. One approach to meeting both of these requirements is to make use of recently developed nanocomposite solders with enhanced creep resistance, and to characterize these solders using a nanoindentation technique. In the present study, the creep behavior of ceria-reinforced nanocomposite solder foils fabricated by the accumulative roll-bonding process was characterized using a depth-sensing nanoindentation technique. It was found that the creep resistance of the composites increased with increasing volume fraction of CeO2reinforcement, and it was deduced that the creep deformation of this nanocomposite proceeded by deformation of the matrix, with the role of the reinforcement being to increase the creep resistance by reducing the effective stress acting on the matrix. The values of the creep exponent suggested that the dominant creep deformation mechanisms involved were diffusion creep and grain boundary sliding.