Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
复制标题
硅片超细磨削中预测晶粒切削深度的解析弹性塑性切削模型
DOI：
10.1115/1.4041245
复制
发表时间：
2018-12-01
影响因子：
4
通讯作者：
Guo, Dongming
中科院分区：
文献类型：
--
作者：
Lin, Bin;Zhou, Ping;Guo, Dongming
磨粒切削深度是决定表面形貌、磨削力和亚表面损伤的主要因素，对硬脆材料制成的成品零件的表面质量有着重要影响。在硅片超精密磨削过程中，采用现有的解析模型预测增益切削深度时，由于晶粒切削深度很浅，与接触力学理论不一致，导致预测结果不合理。本文提出了一种改进的超细旋转磨削磨粒切削深度分析模型，该模型考虑了磨粒形成切屑的最小切削深度、等效磨粒切削刃尖半径、切削过程中的弹性恢复变形和实际有效磨粒数等因素，并对脆性材料的超细旋转磨削进行了预测。实验结果表明，改进后的模型比现有模型具有更高的精度.此外，还分析了磨粒切削深度对三种引入因素的敏感性，提出了在超细粉碎磨粒切削深度预测中考虑这些因素的必要性。
Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle materials. When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics. In this study, an improved model for analyzing the grain depth-of-cut in ultra-fine rotational grinding is proposed, in which the minimum grain depth-of-cut for chip formation, the equivalent grain cutting tip radius, elastic recovery deformation in cutting process, and the actual number of effective grains are considered in the prediction of the ultrafine rotational grinding of brittle materials. The improved model is validated experimentally and shows higher accuracy than the existing model. Furthermore, the sensitivity of the grain depth-of-cut to three introduced factors is analyzed, presenting the necessity of the consideration of these factors during the prediction of grain depth-of-cut in ultrafine grinding.