Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic piezoelectric multi-materials under several boundary conditions on the corner surfaces
Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic piezoelectric multi-materials under several boundary conditions on the corner surfaces
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DOI：
10.1016/j.engfracmech.2016.12.009
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发表时间：
2017-02
影响因子：
5.4
通讯作者：
Mitsutoshi Abe;T. Ikeda;M. Koganemaru;N. Miyazaki
中科院分区：
文献类型：
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作者：
Mitsutoshi Abe;T. Ikeda;M. Koganemaru;N. Miyazaki
结合斯特罗方法和威廉姆斯本征函数方法，可以得到界面角点附近的渐近解。由Betti功的互等定理导出的H积分方法，可用于分析裂纹和角点的应力强度因子。通过将这些理论推广到三维各向异性压电材料间的界面角，我们发展了一种改进的H积分方法。该方法通用性强，可以处理多种材料和边界条件的角点拼接问题。提出了一种新的各向异性压电复合材料界面角部应力强度因子的定义，该定义与均匀材料裂纹和界面裂纹的应力强度因子定义一致，并适用于各种坐标系.通过将应力强度因子的渐近解与有限元法直接得到的应力/电位移场进行比较，证实了所得到的应力强度因子的准确性。我们还提出了一种数值方法退化材料，这导致数值问题的斯特罗形式主义。
Asymptotic solutions around an interfacial corner can be obtained by a combination of the Stroh formalism and the Williams eigenfunction method. TheH-integral method, which is derived from Betti’s reciprocal theorem, is useful for analyzing the stress intensity factors (SIFs) of cracks and corners. By expanding these theories for a three-dimensional interfacial corner between anisotropic piezoelectric multi-materials, we develop a modifiedH-integral method. This method has high generality that can deal with a jointed corner with a varied number of materials and boundary conditions on corner surfaces. We proposed a new definition for the SIFs of an interfacial corner between anisotropic piezoelectric multi-materials, which is compatible with the SIF definitions of a crack in a homogeneous material and an interfacial crack, as well as applicable in various coordinate systems. The accuracy of obtained SIFs was confirmed by comparing the asymptotic solutions obtained from the SIFs with the stress/electric-displacement field directly obtained by the finite element method (FEM). We also propose a numerical method for degenerate materials, which cause numerical problems in the Stroh formalism.