Co-effect of heat and direct current on growth of intermetallic layers at the interface of Ti-Ni diffusion couples
Co-effect of heat and direct current on growth of intermetallic layers at the interface of Ti-Ni diffusion couples
复制标题
DOI：
10.1016/j.jallcom.2010.09.182
复制
发表时间：
2011-01
影响因子：
6.2
通讯作者：
Y. Zhou;Qunhui Wang;D. Sun;Xiao Han
中科院分区：
文献类型：
--
作者：
Y. Zhou;Qunhui Wang;D. Sun;Xiao Han
研究了热和直流共同作用下Ti-Ni扩散偶界面金属间层的生长。分别在500、600和700℃下对Ti-Ni偶体进行了5、10和15h的等温扩散处理，并分别通过和不通过10A强度的直流电流。结果表明，在不同工艺处理的合金中，Ti2Ni和tini3层均在Ti-Ni界面形成，但在600℃以上无电流退火和500℃有电流退火的合金中形成了TiNi层。整个界面层的生长随时间呈抛物线关系。在无电流加热时，整个界面层的表观生长活化能为83.76kJ/mol，在10A直流加热时，整个界面层的表观生长活化能降至42.11kJ/mol。电流对不同金属间层生长的影响随其方向不同而不同。
The growth of the intermetallic layers at the interface of Ti–Ni diffusion couples was investigated under the co-effect of heat and direct current. Isothermal diffusion treatments for Ti–Ni couples were conducted at 500, 600 and 700°C for 5, 10 and 15h with and without the passage of DC current of 10A intensity. It was found that both Ti2Ni and TiNi3layer form at the Ti–Ni interface in all couples treated by different process, but TiNi layer forms in the couples annealed above 600°C without current or at 500°C with current. The growth of the whole interfacial layer shows a parabolic relationship with time. The apparent activation energy of growth for the whole interfacial layer is 83.76kJ/mol in the couple treated by heating without a current, and it decreases to 42.11kJ/mol in the couple treated with a direct current of 10A during heating. The effect of the current on the growth of different intermetallic layers varies with its direction.