TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems
TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems
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DOI：
10.23919/date51398.2021.9474011
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发表时间：
2021-02
期刊：
影响因子：
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通讯作者：
Yenai Ma;Leila Delshadtehrani;Cansu Demirkıran;José L. Abellán;A. Joshi
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作者：
Yenai Ma;Leila Delshadtehrani;Cansu Demirkıran;José L. Abellán;A. Joshi
如今，异构系统通常用于维持我们通过技术扩展所取得的历史性优势。2.5D集成技术为设计异构系统提供了一种具有成本效益的解决方案。2.5D异构系统的传统物理设计紧密地封装小芯片以最小化线长，但这导致热效率低下的设计。我们提出了TAP-2.5D：第一个开源的网络路由和热感知小芯片布局方法的异构2.5D系统。TAP-2.5D战略性地在小芯片之间插入间距，以最大限度地降低温度和总线长，从而增加整个系统的热设计功率包络。我们提出了三个案例研究证明TAP-2.5D的使用和疗效。
Heterogeneous systems are commonly used today to sustain the historic benefits we have achieved through technology scaling. 2.5D integration technology provides a cost-effective solution for designing heterogeneous systems. The traditional physical design of a 2.5D heterogeneous system closely packs the chiplets to minimize wirelength, but this leads to a thermally-inefficient design. We propose TAP-2.5D: the first open-source network routing and thermally-aware chiplet placement methodology for heterogeneous 2.5D systems. TAP-2.5D strategically inserts spacing between chiplets to jointly minimize the temperature and total wirelength, and in turn, increases the thermal design power envelope of the overall system. We present three case studies demonstrating the usage and efficacy of TAP-2.5D.