Microstructure and mechanical properties of diamond/Cu composite joint using Ag-Cu-Ti active brazing alloy
Microstructure and mechanical properties of diamond/Cu composite joint using Ag-Cu-Ti active brazing alloy
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Ag-Cu-Ti活性钎料金刚石/Cu复合接头的显微组织与力学性能
DOI:
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发表时间:
2013
期刊:
影响因子:
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通讯作者:
Qu, Xuan-Hui
中科院分区:
文献类型:
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作者:
Wang, Yue;Chen, Xiao-Wei;He, Xin-Bo;Qu, Xuan-Hui