Indentation plastic displacement field: Part I. The case of soft films on hard substrates
Indentation plastic displacement field: Part I. The case of soft films on hard substrates
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DOI：
10.1557/jmr.1999.0295
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发表时间：
1999-06
影响因子：
2.7
通讯作者：
T. Tsui;J. Vlassak;W. Nix
中科院分区：
文献类型：
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作者：
T. Tsui;J. Vlassak;W. Nix
利用聚焦离子束球磨和成像技术，研究了在硬硅衬底上制备的柔软、多孔的钛铝多层膜上的Knoop压痕的塑性变形行为。如果压痕深度大于总薄膜厚度的30%，则会出现堆积现象。对压痕截面的分析表明，压痕周围的塑性变形部分地被多层膜内孔洞的闭合所调节。这种致密化过程减少了形成的堆积量，低于有限元模拟预测的量。实验结果表明，堆积是由压痕边缘附近的钛层厚度增加形成的。薄膜/衬底界面附近的增厚幅度最大，向多层膜表面方向逐渐减小。表征了压头中心附近的法向压缩量，结果表明，随着压痕深度的增加，变形变得更加不均匀。
The plastic deformation behavior of Knoop indentations made in a soft, porous titanium/aluminum multilayered thin film on a hard silicon substrate is studied through use of the focused-ion-beam milling and imaging technique. Pileup is observed for indentations with depths larger than 30% of the total film thickness. Analysis of the indentation cross sections shows that plastic deformation around the indentation is partly accommodated by the closing of the pores within the multilayers. This densification process reduces the amount of pileup formed below that predicted by finite element simulations. Experimental results show that the pileup is formed by an increase of the titanium layer thickness near the edges of the indentation. The thickness increase is largest near the film/substrate interface and decreases toward the surface of the multilayered film. The amount of normal compression near the center of the indenter is characterized, and it is demonstrated that the deformation becomes more nonuniform with increasing indentation depth.