Study on Multi-slicing of Monocrystalline Silicon by Wire EDM-Investigation of Machining Condition for Stable High Speed Processing-
Study on Multi-slicing of Monocrystalline Silicon by Wire EDM-Investigation of Machining Condition for Stable High Speed Processing-
复制标题
单晶硅线切割多层切片研究-稳定高速加工的加工条件研究-
DOI:
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发表时间:
2004
期刊:
影响因子:
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通讯作者:
Yoshiyuki UNO
中科院分区:
文献类型:
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作者:
Mutsumi TOUGE;Junji WATANABE;H.Soyama;大塚二郎;宇野義幸;J Otsuka;Yoshiyuki UNO