Acoustic Emission in Power Semiconductor Modules-First Observations
Acoustic Emission in Power Semiconductor Modules-First Observations
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DOI:
10.1109/tpel.2013.2295460
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发表时间:
2014-11-01
影响因子:
6.7
通讯作者:
Silventoinen, Pertti
中科院分区:
文献类型:
--
作者:
Karkkainen, Tommi J.;Talvitie, Joonas P.;Silventoinen, Pertti
Traditionally, condition monitoring of power semiconductor modules has been based on electrical measurements. Acoustic emission has been utilized for condition monitoring in many other applications, but is an unknown phenomenon in power semiconductor modules. In this paper, the authors present an experimental setup used to show that acoustic emission does occur because of the switching of power semiconductor components. An analysis based on propagation delays is used to determine the source of the acoustic emission.