Stress evolution on gel-to-ceramic thin film conversion
Stress evolution on gel-to-ceramic thin film conversion
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DOI：
10.1007/s10971-006-9213-x
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发表时间：
2006-12-01
影响因子：
2.5
通讯作者：
Kozuka, Hiromitsu
中科院分区：
文献类型：
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作者：
Kozuka, Hiromitsu
在加热过程中对烷氧化物凝胶涂层进行了原位开裂观察、未开裂临界厚度评估和原位应力测量。较高的水醇比和较低的加热速率表明在较低的温度下会导致开裂。原位应力测量结果表明，溶液中较高的水醇比和较低的加热速率导致加热阶段产生较大的面内拉应力，这被认为是导致较低温度下开裂的原因。甲基三乙氧基硅烷、螯合剂和聚乙烯吡咯烷酮对提高解裂临界厚度和/或厚膜形成是有效的。原位应力测量结果表明，这些添加剂或组分能有效抑制加热过程中的应力演化。
In situ cracking observation, uncracking critical thickness evaluation and in situ stress measurement were conducted during heating for alkoxide-derived gel coating films. Higher water-to-alkoxide ratios and lower heating rates were shown to cause cracking at lower temperatures. The in situ stress measurement suggested that higher water-to-alkoxide ratios in solutions and lower heating rates result in larger in-plane tensile stress to be generated in the heating-up stage, which was thought to cause the cracking at lower temperatures. Methyltriethoxysilane, chelating agents and polyvinylpyrrolidone were shown to be effective in increasing uncracking critical thickness and/or thick film formation. The in situ stress measurement suggested that these additives or components are effective in suppressing the stress evolution during heating.