Optimizing strength and ductility in Cu–Al alloy with recrystallized nanostructures formed by simple cold rolling and annealing
Optimizing strength and ductility in Cu–Al alloy with recrystallized nanostructures formed by simple cold rolling and annealing
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DOI：
10.1007/s10853-014-8299-8
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发表时间：
2014-05
影响因子：
4.5
通讯作者：
Y. Tian;L. J. Zhao;S. Chen;D. Terada;A. Shibata;N. Tsuji
中科院分区：
文献类型：
--
作者：
Y. Tian;L. J. Zhao;S. Chen;D. Terada;A. Shibata;N. Tsuji
采用冷轧后退火的方法制备了具有低层错能的单相Cu-Al合金。经过不同温度的等温退火，得到了由超细晶粒组成的完全再结晶的显微组织。获得的最小平均晶粒尺寸小于1 μm。结果表明，在400℃退火后组织均匀，在300℃和550℃退火后组织不均匀。通过控制微观组织的晶粒尺寸，获得了较好的强度和延展性。在400℃退火10 s后，得到了均匀的再结晶材料，平均晶粒尺寸为770 nm，屈服强度达到524.2 MPa，均匀伸长率达到15.7%。
A single-phase Cu–Al alloy with a low stacking fault energy was processed by cold rolling and subsequent annealing. Fully recrystallized microstructures composed of ultrafine grains were obtained after isothermal annealing at different temperatures. The minimum mean grain sizes achieved were below 1 μm. It was found that the microstructures were homogeneous after annealing at 400 °C, but somehow inhomogeneous after annealing at lower temperature of 300 °C and higher temperature of 550 °C. Superior strength and ductility were obtained by controlling the grain size of the microstructures. After annealing at 400 °C for 10 s, a fully and homogeneously recrystallized material with mean grain size of 770 nm was produced, which had a high yield strength of 524.2 MPa and a remarkable uniform elongation of 15.7 %.