Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI
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DOI：
10.1109/3dic.2012.6262957
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发表时间：
2012-08
期刊：
影响因子：
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通讯作者：
A. Noriki;Kang-wook Lee;J. Bea;T. Fukushima;Tetsu Tanaka;M. Koyanagi
中科院分区：
文献类型：
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作者：
A. Noriki;Kang-wook Lee;J. Bea;T. Fukushima;Tetsu Tanaka;M. Koyanagi
为了实现高性能的计算系统，我们提出了一种新型的光电三维大规模集成电路，其中既有电气和光学器件集成。为了实现这样的光电三维大规模集成电路，通过硅光子通孔（TSPV）是必不可少的垂直光传输。此外，垂直传输的光必须弯曲并耦合到LSI芯片上的平面光波导。为此，我们提出了单向光耦合器，它显示了非常高的耦合效率的TSPV和平面光波导。本文利用时域有限差分法（FDTD）对高效率单向光耦合器的加工容差进行了评估。从模拟结果可以看出，耦合器的光栅间距是实现高效光耦合的最关键结构参数。为了实现80%的耦合效率，光栅节距波动的标准变化应小于20nm。我们还证明了单向光耦合器的失调容限。1 μm的失调引起20%的光损耗。如果失调可以小于0.1 μm，光损耗变得几乎可以忽略不计。
To realize very high performance computing system, we have proposed a novel opto-electronic 3-D LSI in which both electrical and optical devices are integrated. To realize such opto-electronic 3-D LSI, through Si photonic via (TSPV) is indispensable for vertical light transmission. In addition, vertically transmitted light has to be bended and coupled to a planar optical waveguide on the LSI chips. For this purpose, we have proposed unidirectional optical coupler and it shows very high coupling efficiency of the TSPV and the planar optical waveguide. In this work, we evaluated a fabrication tolerance of the high efficient unidirectional optical coupler by FDTD (Finite-Difference Time-Domain) method. From the simulation results, we found that a grating pitch of the coupler was most critical structural parameter to realize high efficient optical coupling. A standard variation of the grating pitch fluctuation should be less than 20nm to realize 80% coupling efficiency. We also showed that a misalignment tolerance of the unidirectional optical coupler. The misalignment of 1 μm induced 20% optical loss. If the misalignment could be less than 0.1 μm, the optical loss became almost negligible.