Thermal shock behavior of 30 wt%BAS/Si 3N 4 self-reinforced composite
Thermal shock behavior of 30 wt%BAS/Si 3N 4 self-reinforced composite
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DOI：
10.1016/j.jallcom.2009.12.078
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发表时间：
2010-03
影响因子：
6.2
通讯作者：
F. Ye;Limeng Liu;Haijiao Zhang;B. Wen
中科院分区：
文献类型：
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作者：
F. Ye;Limeng Liu;Haijiao Zhang;B. Wen
采用水淬法研究了30wt%BAS/Si 3 N4复合材料的热震性能。结果表明，所研究的复合材料具有优异的抗热震性。该复合材料的临界温差（ΔTc）大于1100°C，在1100°C的淬火温差下，其残余强度几乎不受淬火循环次数的影响。这归因于其高强度和低杨氏模量。原位生长的β-Si 3 N4晶粒通过裂纹偏转和晶粒拔出机制提高了材料的抗热震性能。此外，淬火前在样品表面上形成的氧化物层可以作为额外的热障，并导致热冲击强度的降低。
The thermal shock behavior of 30wt%BAS/Si3N4composite was evaluated by the water-quenching technique. The results show that the investigated composite possesses excellent thermal shock resistance. The critical temperature difference (ΔTc) of the composite is over 1100°C and the retained strength at a quenching-temperature difference of 1100°C is hardly affected by the quenching cycles. It is attributed to its high strength and low Young's modulus. The in situ growth of elongated β-Si3N4grains are also beneficial to the improvement of thermal shock resistance due to the increased crack propagation resistance by crack deflection and grain pull-out mechanisms. In addition, the formation of an oxide layer on the sample surface before quenching may act as an additional thermal barrier and leads to a reduction in the intensity of thermal shock.