Microstructure and Thermo-Physical Properties of TiB2/Si-30Al Composite for Electronic Packaging Applications
Microstructure and Thermo-Physical Properties of TiB2/Si-30Al Composite for Electronic Packaging Applications
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DOI：
10.4028/www.scientific.net/msf.687.138
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发表时间：
2011-06
期刊：
影响因子：
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通讯作者：
Gui-Sheng Gan;Lei Zhang;Yi Lu;Bin Yang
中科院分区：
文献类型：
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作者：
Gui-Sheng Gan;Lei Zhang;Yi Lu;Bin Yang
2wt.%TiB_2/Si-30Al复合材料的制备方法是先原位反应、喷射成形，然后进行热等静压。利用扫描电子显微镜和热膨胀分析仪对复合材料的微观组织和热物理性能进行了研究。结果表明，TiB_2/Si-30Al复合材料的显微组织由初生硅(~35μm)、互穿第二相Al相和细小的TiB_2颗粒(1~2μm)组成。TiB_2颗粒均匀分布在Si-30Al合金中。热等静压处理后，TiB_2/Si-30Al复合材料中的气孔基本消除，复合材料的相对密度达到98.9%。热等静压处理后的2wt.%TiB2/Si-30Al复合材料具有良好的热膨胀系数(CTE)(6.6×10-6×K-1)和较高的导热系数(84W×m-1×K-1)。
2wt.%TiB2/Si-30Al composite was prepared by in-situ reaction and spray forming first and then by hot isostatic pressing (HIP). The microstructure and thermo-physical properties of the composite were investigated by means of scanning electron microscopy, and thermal expansion analyzer respectively. The results show that the microstructure of the TiB2/Si-30Al composite consists of a continuous network of primary Si (~35μm), interpenetrating secondary Al phase, and fine TiB2 particles (1~2μm). The TiB2 particles were uniformly distributed in the Si-30Al alloy matrix. After HIP, the pores in the TiB2/Si-30Al composite were almost eliminated, and the relative density of the composite was up to 98.9%. The 2wt.%TiB2/Si-30Al composite after the HIP exhibits good thermo-physical properties, including lower coefficient of thermal expansion (CTE) (6.6´10-6×K-1) and higher thermal conductivity (84 W×m-1×K-1).