Modeling the moisture and temperature dependent material behavior of adhesive bonds
Modeling the moisture and temperature dependent material behavior of adhesive bonds
复制标题
对粘合剂的湿度和温度依赖性材料行为进行建模
DOI：
10.1002/pamm.201510138
复制
发表时间：
2015
期刊：
影响因子：
--
通讯作者：
S. Diebels
中科院分区：
文献类型：
--
作者：
F. Goldschmidt;S. Diebels
虽然胶接技术已经被人们所熟知很长时间了，但胶接接头的力学行为越来越受到科学界的关注。在使用过程中，粘合剂会受到温度、湿度和辐射等环境影响。由于粘合剂通常由聚合物组成，这些影响会改变它们的力学行为。在本文中，研究了一种粘弹性交联聚氨酯，其行为不可压缩。提出了一个三维力学模型，该模型考虑了温度变化以及粘合剂层内部水分浓度及其厚度变化对力学行为的影响。（© 2015 Wiley‐VCH Verlag GmbH & Co. KGaA，魏因海姆）
Although bonding has been known for a long time, the mechanical behavior of adhesive bonded joints comes more and more into the focus of scientific attention. During usage, adhesives are exposed to environmental influences like temperature, moisture and radiation. Due to the fact that adhesives usually consist of polymers, these influences change their mechanical behavior.In the presented work, a viscoelastic cross‐linked polyurethane that behaves incompressible is investigated. A three‐dimensional mechanical model is presented, which takes into consideration influences of changes in temperature as well as in the moisture concentration inside the adhesive layer and its thickness on the mechanical behavior. (© 2015 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)
影响因子：
2.8
作者：
Goldschmidt, Florian;Diebels, Stefan
通讯作者：
Diebels, Stefan
基于多相连续介质力学的弹性体化学热机械老化
影响因子：
2.6
作者：
M. Johlitz;A. Lion
通讯作者：
A. Lion