Nanometric cutting in a scanning electron microscope
Nanometric cutting in a scanning electron microscope
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扫描电子显微镜中的纳米切割
DOI：
10.1016/j.precisioneng.2015.01.009
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发表时间：
2015-07-01
影响因子：
3.6
通讯作者：
Xu, Zongwei
中科院分区：
文献类型：
--
作者：
Fang, Fengzhou;Liu, Bing;Xu, Zongwei
研制了一种高真空条件下的扫描电子显微镜纳米切割装置。研究了纳米切割平台的性能、刀具-样品定位和加工能力。所提出的装置可以用来实现7 μ m的位移，在切割方向和深度方向的闭环分辨率为0.6 nm。利用聚焦离子束（FIB）加工形成的刃口半径为43 nm的金刚石刀具，在扫描电镜（SEM）在线观察下，在自行研制的切割装置上对单晶硅进行了纳米切割实验。研究了不同切削深度下的切屑和加工效果，得到了切削深度小于10 nm且重复性好的加工结果。此外，切削速度被发现表现出很强的脆性材料的脆韧性转变深度的关系。锥形切割和正弦切割的实验结果表明，所开发的设备具有执行多自由度（DOF）切割和研究纳米材料去除行为的能力。(C)2015 Elsevier Inc. All rights reserved.
A nanometric cutting device under high vacuum conditions in a scanning electron microscope (SEM) was developed. The performance, tool-sample positioning, and processing capacity of the nanometric cutting platform were studied. The proposed device can be used to realize a displacement of 7 mu m, with a closed-loop resolution of 0.6 nm in both the cutting direction and the depth direction. Using a diamond cutting tool with an edge radius of 43 nm formed by focused ion beam (FIB) processing, nanometric cutting experiments on monocrystalline silicon were performed on the developed cutting device under SEM online observation. Chips and machining results of different depths of cut were studied during the cutting process, and cutting depths of less than 10 nm could be obtained with high repeatability. Moreover, the cutting speed was found to exhibit a strong relationship with the brittle-ductile transition depth on brittle material. The experimental results of taper cutting and sinusoidal cutting indicated that the developed device has the ability to perform multiple degrees of freedom (DOFs) cutting and to study nanoscale material removal behaviour. (C) 2015 Elsevier Inc. All rights reserved.