Subcritical crack growth and threshold in borosilicate glass
Subcritical crack growth and threshold in borosilicate glass
复制标题
硼硅酸盐玻璃中的亚临界裂纹扩展和阈值
DOI：
--
复制
发表时间：
1991
期刊：
影响因子：
--
通讯作者：
D. Munz
中科院分区：
文献类型：
--
作者：
T. Fett;K. Germerdonk;A. Grossmüller;K. Keller;D. Munz
通过对努普损伤试样的寿命测量，研究了硼硅酸盐玻璃的裂纹扩展行为。特别观察了阈值行为，并详细研究了残余楔应力和低于阈值的预压的影响。发现阈值klth = 0.38 mpam /2。由Knoop压痕引起的残余应力强度因子为0,0.1 mpam /2。在低于阈值的静态试验中，阈值提高ΔKlth≃0.15 mpam /2。
The crack-growth behaviour of borosilicate glass was investigated by use of lifetime measurements on Knoop-damaged specimens. The threshold behaviour in particular was observed, and the influence of residual wedging stresses and preloading below the threshold value were studied in detail. A threshold ofKlth = 0.38 MPam1/2 was found. The residual stress intensity factor caused by the Knoop indentations was found to beKlres,0≃ 0.1 MPam1/2. In a static test performed below the threshold, the threshold value was increased by ΔKlth≃ 0.15MPam1/2.