Dielectric Relaxation Phenomena of Polylactic Acid with -Crystalline Chitin
Dielectric Relaxation Phenomena of Polylactic Acid with -Crystalline Chitin
复制标题
结晶甲壳素聚乳酸的介电弛豫现象
DOI：
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
S. Fujita
中科院分区：
文献类型：
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作者：
K. Shinyama;T. Oi;S. Fujita
?-将结晶甲壳质加入到聚乳酸（PLA）中，然后将该PLA在100 ℃下热处理1分钟。热处理后的聚乳酸结晶度提高到40%以上，结晶速度也明显加快。这些材料的相对介电常数（？你呢？）
和相对介电损耗因子（？也被审查。介电吸收峰值在？加入甲壳素的PLA的拉伸曲线小于未加甲壳素的PLA。此外，Havriliak-Negami松弛函数被用来产生近似曲线的频率依赖性？你说呢？然后呢？在80 ° C下将甲壳素与加入的PLA混合。结果表明，弛豫强度Δ？加入甲壳素的PLA的松弛时间（？）加入甲壳素的PLA的降解速率是未加入甲壳素的PLA的2.5倍。
?-crystalline chitin was added to polylactic acid (PLA), and this PLA was then heat-treated at 100∘C for one minute. The crystallinity of the heat-treated PLA increased to more than 40%, and its crystallization speed also increased significantly. The temperature dependency of these materials’ relative permittivity (??)
and relative dielectric loss factor (??) was also examined. The dielectric absorption peak value in ?? curve of the PLA to which chitin was added and was smaller than that of PLA without chitin. Additionally, the Havriliak-Negami relaxation function was used to produce approximation curves for the frequency dependency of ?? and ?? of chitin with PLA added at 80∘C. As a result, the relaxation strength (Δ?) of the chitin with PLA added was smaller than that of the PLA without chitin, and the relaxation time (?) of the chitin with PLA added was approximately 2.5 times larger than that of the PLA without chitin.