Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn–Ag–Cu solder bumps
Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn–Ag–Cu solder bumps
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DOI：
10.1016/j.jallcom.2014.03.047
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发表时间：
2014-07
影响因子：
6.2
通讯作者：
Mingliang L. Huang;F. Yang;N. Zhao;Yang Yaochun
中科院分区：
文献类型：
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作者：
Mingliang L. Huang;F. Yang;N. Zhao;Yang Yaochun
采用同步辐射实时成像技术原位研究了Ni-P凸点下金属化（UBM）上亚50 μm Sn-4. 0Ag-0. 5Cu倒装焊凸点中Ag 3Sn板的溶解和析出行为。在加热阶段，Ag 3Sn大板的溶解速率为0.1-0.2 μm/s，而在过冷度为31-55 °C的冷却阶段，Ag 3Sn大板的析出速率超过5 μm/s。原位观察了Ag 3Sn板的无规析出行为，并从团簇的角度解释了这一现象。该研究为研究真实的超细焊点的组织演变和过冷度提供了一种有效的方法。
Synchrotron radiation real-time imaging technology was used to in situ study the dissolution and precipitation behavior of Ag3Sn plates in sub-50 μm Sn–4.0Ag–0.5Cu flip chip solder bumps on Ni–P under bump metallization (UBM). The dissolution rate of large Ag3Sn plates was as slow as 0.1–0.2 μm/s at the heating stage, while the precipitation rate exceeded 5 μm/s at the cooling stage with an undercooling of 31–55 °C. The random precipitation behavior of Ag3Sn plates was in situ observed and explained from the perspective of cluster. This study shows an effective method to investigate the microstructural evolution and the undercooling of phases in real ultra-fine solder joints.