Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes
Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes
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DOI：
10.1021/acsaelm.2c01146
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发表时间：
2022-11
影响因子：
4.7
通讯作者：
Takumi Furusawa;Rin Ando;Hiroaki Daiguji;Jeongmin Jang;Mikuto Funabe;Jun-ichi Matsui;M. Ishizaki;M. Kurihara
中科院分区：
文献类型：
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作者：
Takumi Furusawa;Rin Ando;Hiroaki Daiguji;Jeongmin Jang;Mikuto Funabe;Jun-ichi Matsui;M. Ishizaki;M. Kurihara
从具有成本效益且丰富的材料形成低温溶液处理电极有望实现全溶液处理薄膜器件。银微板（AgML）可以替代通过高能量和高材料消耗工艺（例如真空蒸发沉积）形成的金属电极;然而，AgML的固有电位仍然被掩盖，限制了工业应用和科学研究。在这里，制备了横向生长至3 μm的AgML，并通过其在聚四氟乙烯膜上的水性分散液过滤。借助于膜的溶剂润湿性和柔性，在膜上形成面对面堆叠的AgML膜，并且在没有任何外部压力的情况下粘附到玻璃板上。在湿溶剂蒸发后，膜自发地转移到板上。发现了AgML的低温边缘熔化现象。热重分析-同步质谱显示，AgML的{100}表面通过催化N-C键断裂引发边缘熔合，这引发了表面保护聚乙烯吡咯烷酮在≤200 °C下的低温分解。边缘熔合使AgML膜的体积电阻率显著提高到个位数（1.7 μΩ cm），但体银的电阻率仍高于1.6 μΩ cm。我们还提到了一种溶剂相容的方法，用于将AgML膜转移到溶剂敏感的钙钛矿材料如CH 3 NH3 PbI 3和CsPbBr 3上。
The formation of low-temperature solution-processed electrodes from cost-effective and abundant materials is expected to realize all-solution-processed film devices. Silver microplates (AgMLs) can replace metal electrodes formed via high-energy and high-material-consuming processes such as vacuum-evaporation deposition; however, the intrinsic potentials of AgMLs have remained veiled, limiting both industrial applications and scientific research. Here, AgMLs with lateral growth to 3 μm are prepared and filtered through their aqueous dispersion solution on a polytetrafluoroethylene membrane. Assisted by the solvent wettability and flexibility of the membrane, a face-to-face stacked AgML film forms on the membrane and adheres to a glass plate without any external pressure. The film spontaneously transfers onto the plate after the wet solvent evaporates. A low-temperature edge-fusing phenomenon of AgMLs is discovered. Thermogravimetric analysis–synchronized mass spectroscopy reveals that edge fusion is induced from the {100} surfaces of AgMLs by catalytic N–C bond cleavage, which triggers low-temperature decomposition of the surface-protecting polyvinylpyrrolidone at ≤200 °C. The edge fusion markedly improves the volume resistivity of the AgML film to single digits (∼7 μΩ cm), but the resistivity is still higher than 1.6 μΩ cm in bulk silver. We also mention a solvent-compatible method for transferring a AgML film onto solvent-sensitive perovskite materials such as CH3NH3PbI3and CsPbBr3.