Electromagnetic Thermal Energy Transfer in Nanoparticle Assemblies Below Diffraction Limit
Electromagnetic Thermal Energy Transfer in Nanoparticle Assemblies Below Diffraction Limit
复制标题
纳米颗粒组件中低于衍射极限的电磁热能传递
DOI：
10.1115/1.4047631
复制
发表时间：
2021
影响因子：
2.1
通讯作者：
Murthy, Jayathi
中科院分区：
文献类型：
--
作者：
Yuksel, Anil;Yu, Edward T.;Cullinan, Michael;Murthy, Jayathi
由于器件和互连尺寸的缩小以及电子、航空航天和医疗应用的先进封装和组装，对微米级和纳米级电子元件的制造的要求越来越高。增材制造的最新进展使得制造微型 3D 互连结构成为可能，但制造过程中的传热是影响这些互连结构可靠制造的最重要现象之一。在这项研究中，研究了三维 (3D) 纳米粒子堆积的光学吸收和散射，以深入了解纳米粒子内的微/纳米热传输。由于胶体溶液的干燥会产生不同的纳米粒子构型，因此研究了三种不同铜纳米粒子堆积构型中的等离子体耦合：简单立方（SC）、面心立方（FCC）和六方密堆积（HCP）。将单散射反照率 (ω) 分析为纳米颗粒尺寸、堆积密度和配置的函数，以评估纳米颗粒堆积内铜纳米颗粒的热光特性和等离子体耦合的影响。该分析提供了对铜纳米颗粒中等离子体增强吸收及其对纳米颗粒组件激光加热的影响的深入了解。
Fabrication of micro- and nanoscale electronic components has become increasingly demanding due to device and interconnect scaling combined with advanced packaging and assembly for electronic, aerospace, and medical applications. Recent advances in additive manufacturing have made it possible to fabricate microscale, 3D interconnect structures but heat transfer during the fabrication process is one of the most important phenomena influencing the reliable manufacturing of these interconnect structures. In this study, optical absorption and scattering by three-dimensional (3D) nanoparticle packings are investigated to gain insight into micro/nano heat transport within the nanoparticles. Because drying of colloidal solutions creates different configurations of nanoparticles, the plasmonic coupling in three different copper nanoparticle packing configurations was investigated: simple cubic (SC), face-centered cubic (FCC), and hexagonal close packing (HCP). Single-scatter albedo (ω) was analyzed as a function of nanoparticle size, packing density, and configuration to assess effect for thermo-optical properties and plasmonic coupling of the Cu nanoparticles within the nanoparticle packings. This analysis provides insight into plasmonically enhanced absorption in copper nanoparticle particles and its consequences for laser heating of nanoparticle assemblies.
影响因子：
16.6
作者：
Harvey A;Backes C;Boland JB;He X;Griffin A;Szydlowska B;Gabbett C;Donegan JF;Coleman JN
通讯作者：
Coleman JN