High-temperature reliability of integrated circuit based on 4H-SiC MOSFET with Ni/Nb ohmic contacts for harsh environment applications
High-temperature reliability of integrated circuit based on 4H-SiC MOSFET with Ni/Nb ohmic contacts for harsh environment applications
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DOI:
10.35848/1347-4065/abc924
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发表时间:
2020-11
影响因子:
1.5
通讯作者:
Vuong Van Cuong;S. Ishikawa;Tomonori Maeda;H. Sezaki;T. Meguro;S. Kuroki
中科院分区:
文献类型:
--
作者:
Vuong Van Cuong;S. Ishikawa;Tomonori Maeda;H. Sezaki;T. Meguro;S. Kuroki
The high-temperature reliability of integrated circuit based on 4H-SiC MOSFET with Ni/Nb ohmic contacts was investigated at 400 °C in N2 ambient. The results showed that the single stage amplifier remained a stable voltage gain after 100 h of aging at 400 °C. Based on the transfer length method, the Ni/Nb/n-type 4H-SiC ohmic contact exhibited the excellent stability after being aged at 400 °C for 100 h. Whereas, the stability of electrical characteristics indicated that the 4H-SiC MOSFET also exhibited a good stability when operating in high temperature environment. Moreover, the stability of the electrical characteristics of the 4H-SiC MOS capacitor showed that the reliability of the Ni/Nb/4H-SiC ohmic contact played important role in reliability of SiC based devices. These results indicate that the fabrication process of the integrated circuits based on 4H-SiC devices with Ni/Nb ohmic contacts is promising to apply for high temperature as well as harsh environment applications.