Fully Inkjet‐Printed Stress‐Tolerant Microelectromechanical Reed Relays for Large‐Area Electronics
Fully Inkjet‐Printed Stress‐Tolerant Microelectromechanical Reed Relays for Large‐Area Electronics
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适用于大面积电子产品的全喷墨印刷耐应力微机电簧片继电器
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
V. Subramanian
中科院分区：
文献类型：
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作者：
M. A. Karim;Seungjun Chung;E. Alon;V. Subramanian
利用印刷技术对溶液处理材料进行图案化沉积是实现低成本和大面积电子产品的关键因素。虽然已经有几个印刷晶体管的演示，但由于难以实现鲁棒的印刷悬挂结构，印刷MEMS的报道通常很少。在这里，首次展示了全喷墨印刷的三端微机电（MEM）干簧继电器，该继电器对印刷继电器中经常观察到的机械应力变化具有出色的抗扰度。揭示了一种新颖的MEM簧片继电器结构，其中由于膜中的应力梯度而导致的印刷簧片的向上卷曲受到印刷阻挡簧片的限制，从而提供对应力变化的免疫力。印刷干簧继电器具有超突变开关特性，通态电阻仅为15 Ω，关态泄漏不可测量，开关延迟为32 μs，可稳定工作超过105个周期。建立了干簧继电器关断电压的解析模型，并与不同干簧继电器几何参数的实验结果进行了对比验证。所展示的干簧继电器的全印刷加工能力，以及它们的耐应力特性和出色的器件性能，证实了它们作为低成本和大面积电子设备的新型开关器件的前景。
Patterned deposition of solution‐processed materials utilizing printing technologies is a key enabler for the realization of low‐cost and large‐area electronics. While there have been several demonstrations of printed transistors, reports of printed MEMS have been generally sparse due to the difficulty in realizing robust printed suspended structures. Here, the first demonstration of fully inkjet‐printed three‐terminal microelectromechanical (MEM) reed relays offering excellent immunity to the mechanical stress variation often observed in printed cantilevers is reported. A novel MEM reed relay architecture is revealed where the upward curling of the printed reed due to the stress gradient in the film is restricted by a printed blocking reed, thus delivering immunity to stress variations. The printed reed relays show hyper‐abrupt switching with an on‐state resistance of only ≈15 Ω, immeasurable off‐state leakage, a switching delay of 32 μs, and stable operation over 105 cycles. An analytical model of the reed relay turn‐off voltage is developed, which is validated against the experimental results with varying reed relay geometrical parameters. The fully printed processing capability of the demonstrated reed relays in tandem with their stress tolerant nature and excellent device performance substantiates their promise as a new switching device for low‐cost and large‐area electronics.