"Zeppelin": An SoC for Multichip Architectures
"Zeppelin": An SoC for Multichip Architectures
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DOI：
10.1109/jssc.2018.2873584
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发表时间：
2019-01-01
影响因子：
5.4
通讯作者：
Naffziger, Samuel
中科院分区：
文献类型：
--
作者：
Burd, Thomas;Beck, Noah;Naffziger, Samuel
AMD的“ Zeppelin”系统启动系统（SOC）结合了八个高性能“ Zen”核与共享16-MB L3 Cache，以及六个高速I/O链接和两个DDR4通道，使用Infinity Infinity织物（如果）提供高速，低潜伏期和功率高效的连接解决方案。该解决方案允许将相同的Soc Silicon模具设计成三个单独的包装，并在三个不同的市场细分市场中提供高度竞争的解决方案。如果对这种高杠杆设计重复使用至关重要，则利用连贯的，可扩展的数据结构（SDF）进行开展通信以及Inter-Die链接，并在两个软件包中延伸了多达八个模具。为了支持这种可伸缩性，设计了一个节能，定制的物理层链接，专为模具之间的内置，高速通信而设计。使用额外的可伸缩控制结构（SCF），使用层次功率和系统管理单元（SMU）来监视和管理一组分布式模具，以确保产品保持在基础架构范围之内。 SOC的平面图与包装基板共同设计。 SOC使用了14 nm的FinFET工艺技术，并在213毫米（2）模具上包含4.8B晶体管。
AMD's "Zeppelin" system-on-a-chip (SoC) combines eight high-performance "Zen" cores with a shared 16-MB L3 Cache, along with six high-speed I/O links and two DDR4 channels, using the infinity fabric (IF) to provide a high speed, low latency, and power-efficient connectivity solution. This solution allows the same SoC silicon die to be designed into three separate packages and provides highly competitive solutions in three different market segments. IF is critical to this high-leverage design re-use, utilizing a coherent, scalable data fabric (SDF) for on-die communication, as well as inter-die links, extending up to eight dies across two packages. To support this scalability, an energy efficient, custom physical-layer link was designed for in-package, high-speed communication between the dies. Using an additional scalable control fabric (SCF), a hierarchical power and system management unit (SMU) was used to monitor and manage a distributed set of dies to ensure the products stay within infrastructure limits. It was essential that the floor plan of the SoC was co-designed with the package substrate. The SoC used a 14-nm FinFET process technology and contains 4.8B transistors on a 213 mm(2) die.