Microstructure, mechanical properties and thermal shock behavior of h-BN-SiC ceramic composites prepared by spark plasma sintering
Microstructure, mechanical properties and thermal shock behavior of h-BN-SiC ceramic composites prepared by spark plasma sintering
复制标题
放电等离子烧结h-BN-SiC陶瓷复合材料的显微组织、力学性能及热震行为
DOI：
10.1016/j.coramint.2016.11.030
复制
发表时间：
2017-02
影响因子：
5.2
通讯作者：
Yi Zhongzhou
中科院分区：
文献类型：
--
作者：
Zhai Fengrui;Li Shuang;Sun Jialin;Yi Zhongzhou
采用放电等离子烧结法制备了不同SiC含量的h-BN-SiC陶瓷复合材料。结果表明，硬质SiC颗粒的加入对复合材料的致密化、显微组织、力学性能和抗热震性能有显著影响。与纯BN陶瓷相比，h-BN-SiC陶瓷复合材料的致密度和力学性能明显提高。当SiC含量为25%时，h-BN-SiC陶瓷复合材料的性能最佳，其相对密度、抗弯强度和断裂韧性分别达到97.8%、289.2 MPa和3.45 MPa m1/2。此外，还讨论了断裂韧性与断裂模式的关系。热震试验结果表明，SiC含量为25%的h-BN-SiC陶瓷复合材料具有优异的抗热震性能，其临界温差可达900 °C。h-BN和SiC在材料表面的高温氧化导致硼硅酸盐玻璃相的形成，可以愈合材料表面的微裂纹，从而提高材料的抗热震性。
h-BN-SiC ceramic composites with different SiC contents were fabricated by spark plasma sintering. The results indicate that the addition of hard SiC particles has a remarkable effect on the densification, microstructure, mechanical properties and thermal shock resistance of the composites. Compared with pureh-BN ceramic, the relative density and mechanical properties ofh-BN-SiC ceramic composites were improved obviously. The optimal properties ofh-BN-SiC ceramic composites were obtained at SiC content of 25%, and the relative density, flexural strength and fracture toughness reached 97.8%, 289.2 MPa and 3.45 MPa m1/2, respectively. Moreover, the relationship of fracture toughness and fracture mode was discussed. The thermal shock test results showed that theh-BN-SiC ceramic composite with the SiC content of 25% exhibited excellent thermal shock resistance, presenting critical temperature difference up to 900 °C. The high temperature oxidation ofh-BN and SiC on material surface led to the formation of borosilicate glass phase, which could heal the surface microcracks and then improve the thermal shock resistance.
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影响因子：
5.2
作者：
Xu Yin;T. Ma;W. Xinhua;Yinzhu Jiang;M. Yan
通讯作者：
Xu Yin;T. Ma;W. Xinhua;Yinzhu Jiang;M. Yan
DOI：
10.1007/bf01770905
发表时间：
1987-06
期刊：
Journal of Materials Science Letters
影响因子：
--
作者：
W. Sinclair;H. Simmons
通讯作者：
W. Sinclair;H. Simmons
影响因子：
5.2
作者：
Chung, Shyan-Lung;Hsu, Yu-Hsiang
通讯作者：
Hsu, Yu-Hsiang
影响因子：
6.2
作者：
Hongbo Li;Yongting Zheng;Jiecai Han;L. Zhou
通讯作者：
Hongbo Li;Yongting Zheng;Jiecai Han;L. Zhou
热压六方氮化硼陶瓷的压力诱导择优晶粒生长、织构发展和各向异性性能
影响因子：
6
作者：
Xue, Jia-Xiang;Liu, Ji-Xuan;Xie, Bin-Huan;Zhang, Guo-Jun
通讯作者：
Zhang, Guo-Jun