Monitoring of SPS Concentration by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution
Monitoring of SPS Concentration by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution
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DOI：
10.1149/2.0841914jes
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发表时间：
2019
影响因子：
3.9
通讯作者：
A. N. Tran;Ha Van Hoang;T. Hirato;K. Kondo
中科院分区：
文献类型：
--
作者：
A. N. Tran;Ha Van Hoang;T. Hirato;K. Kondo
提出了一种新的铜电沉积过程监测方法--旋转环盘电极法。环电流与SPS浓度在0 ~ 3.5ppm范围内呈线性关系。为了最大限度地减少其他添加剂对环电流监测的影响，我们进行了循环伏安法溶出（CVS），以估计聚乙二醇（PEG）和磺化二烯丙基二甲基氯化铵共聚物（SDDACC），整平剂的量。已经进行了硅通孔（TSV）填充以检查溶液的无空隙填充。制备了电解液，在电流密度为3 mA/cm 2的条件下，电解96 h后，TSV的电沉积中形成了孔洞。在监测和添加SPS、PEG和SDDACC后，我们实现了无空隙填充。因此，即使使用三种有机添加剂，电沉积溶液也被更新。
We have devised a new method of monitoring using a rotating ring-disk electrode (RRDE) with dissolving disk copper during copper electrodeposition process. The ring current shows linear relationship with SPS concentration from 0 to 3.5 ppm. To minimize the effects of other additives on ring current monitoring, we have conducted cyclic voltammetry stripping (CVS) to estimate the amount of polyethylene glycol (PEG) and sulfonated diallyl dimethyl ammonium chloride copolymer (SDDACC), the leveler. Through silicon via (TSV) fillings have been carried out to check the void free filling of solutions. The electrolyzed solution has been prepared, after 96 hours of electrolysis, voids are formed in electrodeposition of TSV with current density 3 mA/cm 2. After monitoring and adding SPS, PEG and SDDACC, we have achieved a void free filling. Therefore, electrodeposition solution is refreshed even with three organic additives.