Friction stir processing of direct metal deposited copper–nickel 70/30
Friction stir processing of direct metal deposited copper–nickel 70/30
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DOI：
10.1016/j.msea.2011.01.063
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发表时间：
2011-04
期刊：
影响因子：
6.4
通讯作者：
S. Mukherjee;Amit K. Ghosh
中科院分区：
文献类型：
--
作者：
S. Mukherjee;Amit K. Ghosh
对通过激光辅助直接金属沉积（DMD）沉积在铜-镍70/30基底上的多层铜-镍70/30进行摩擦搅拌处理（FSP）。使用电子显微镜分析了与单次和重叠FSP通过相关的显微结构变化。对FSP前后的力学性能和腐蚀行为进行了评价。据观察，与DMD铜-镍70/30相比，FSP降低孔隙率、细化晶粒、增加硬度、降低延展性并增加腐蚀速率。
Friction stir processing (FSP) was carried out on a multi-layered copper–nickel 70/30, deposited on a copper–nickel 70/30 substrate via laser-assisted direct metal deposition (DMD). Microstructural changes associated with single and overlapping FSP passes were analyzed using electron microscopy. Mechanical property and corrosion behavior were also evaluated before and after FSP. It was observed that FSP reduces porosity, refines grains, increases hardness, reduces ductility and increases corrosion rate in comparison to DMD copper–nickel 70/30.