Effect of annealing temperature on the decomposition of reactively sputtered Ag2Cu2O3 films
Effect of annealing temperature on the decomposition of reactively sputtered Ag2Cu2O3 films
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DOI：
10.1016/j.apsusc.2009.04.140
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发表时间：
2009-06
影响因子：
6.7
通讯作者：
C. Petitjean;D. Horwat;J. Pierson
中科院分区：
文献类型：
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作者：
C. Petitjean;D. Horwat;J. Pierson
采用银-铜复合靶反应溅射法在玻璃基片上制备了Ag 2Cu 2 O3薄膜。将沉积的膜在空气中在100、200和300°C下退火。使用X射线衍射（XRD）的薄膜的结构进行了研究，其表面形貌的特征在于使用扫描电子显微镜（SEM）和其在室温下的电阻率测量使用四点探针法。100°C退火不会改变膜结构或膜形态。另一方面，Ag 2Cu 2 O3薄膜在200°C退火后部分分解为Ag和CuO。对于300°C退火，分解完成。作为退火温度的函数的膜表面形态的演变进行了讨论，在连接的演变的相构成的膜的摩尔体积。
Ag2Cu2O3films were deposited on glass substrates by reactive sputtering of a composite silver–copper target. The deposited films were annealed in air at 100, 200 and 300°C. The structure of the films was studied using X-ray diffraction (XRD), their surface morphology was characterised using scanning electron microscopy (SEM) and their electrical resistivity at room temperature was measured using the four point probe method. The 100°C annealing did not modify either the film structure or the film morphology. On the other hand, Ag2Cu2O3films were partially decomposed into Ag and CuO after a 200°C annealing. The decomposition was complete for a 300°C annealing. The evolution of the film surface morphology as a function of the annealing temperature was discussed in connection to the evolution of the molar volume of the phases constituting the films.