Understanding the surface discharge characteristics of thermally aged copper sulphide diffused oil impregnated pressboard material

Understanding the surface discharge characteristics of thermally aged copper sulphide diffused oil impregnated pressboard material
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DOI:
10.1109/tdei.2015.004905
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发表时间:
2015-11
影响因子:
3.1
通讯作者:
R. Sarathi;K. S. Yadav;M. Swarna
R. Sarathi;K. S. Yadav;M. Swarna
中科院分区:
工程技术3区
文献类型:
--
作者:
R. Sarathi;K. S. Yadav;M. Swarna

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我们尝试了解硫化铜扩散油浸纸板 (OIP) 材料的热老化对表面放电起始电压 (SDIV) 变化的影响。硫化铜扩散OIP材料的SDIV随着热老化的增加而降低。由于硫化铜扩散 OIP 的表面放电而产生的 UHF 信号在起始点的频率范围为 0.7-1.5 GHz,其主频率为 0.9GHz。 HFCT测量表明,在交流电压的负半周和正半周,由于表面放电活动而注入电流脉冲的上升时间分别约为0.8ns和1ns。还发现随着硫化铜扩散OIP热老化的增加,电流脉冲的幅度和宽度增加。硫化铜扩散OIP材料的热老化温度越高,其表面电荷量及其平均寿命就越高。 OIP由于交流电晕充电而获得的表面电荷的极性取决于纸板材料的表面状况,其电荷衰减率低于直流电压下。原子吸收光谱 (AAS) 和能量色散光谱 (EDS) 研究证实了 OIP 表面上存在硫化铜,并且发现与未使用的 OIP 材料相比,硫化铜扩散的 OIP 材料中硫化铜的含量有所增加。扫描电子显微镜 (SEM) 分析表明热老化 OIP 材料形成裂纹。相位分辨局部放电 (PRPD) 研究表明,表面放电活动发生在所施加交流电压的初始峰值附近以及较高电压下所施加交流电压的上升部分。研究发现,与未使用的样品相比,热老化硫化铜扩散 OIP 材料的拉伸和弯曲强度急剧降低。
An attempt has been made to understand the impact of thermal aging with copper sulphide diffused oil impregnated pressboard (OIP) material for surface discharge inception voltage (SDIV) variation. The SDIV of Copper sulphide diffused OIP material reduces with increase in thermal aging. The UHF signals generated due to surface discharges with copper sulphide diffused OIP at the point of inception have frequency content in the range 0.7-1.5 GHz with its dominant frequency at 0.9GHz. HFCT measurement indicated that the rise time of injected current pulse due to surface discharge activity in the negative and positive half cycle of the AC voltage are about 0.8ns and 1ns respectively. It is also found that increase in thermal aging of copper sulphide diffused OIP, the amplitude and width of the current pulse increases. The magnitude of surface charge and its mean life is high with thermal aging temperature of copper sulphide diffused OIP material. Polarity of surface charge acquired by OIP due to AC corona charging depends on the surface condition of the pressboard material and its charge decay rate is lower than under DC voltage. Atomic Absorption Spectroscopy (AAS) and Energy Dispersive Spectrometry (EDS) study confirms the presence of copper sulphide on the surface of OIP and is found to be increased for copper sulfide diffused OIP material compare to unused OIP material. Scanning Electron Microscope (SEM) analysis indicates formation of cracks with thermally aged OIP material. Phase Resolved Partial Discharge (PRPD) study indicates that the surface discharge activity occurs near the peaks of the applied AC voltage at inception and at the rising portion of the applied AC voltage at higher voltages. It is found that the tensile and flexural strength reduces drastically for thermally aged copper sulphide diffused OIP material compare to unused specimen.