Characterization of Si nanostructures using a noncontact mode scanning near-field optical Raman microscope, with 100nm spatial resolution and 5nm depth resolution, using ultraviolet resonant Raman scattering
Characterization of Si nanostructures using a noncontact mode scanning near-field optical Raman microscope, with 100nm spatial resolution and 5nm depth resolution, using ultraviolet resonant Raman scattering
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使用非接触模式扫描近场光学拉曼显微镜表征 Si 纳米结构,空间分辨率为 100 nm,深度分辨率为 5 nm,采用紫外共振拉曼散射
DOI:
10.1063/1.2780114
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发表时间:
2007
影响因子:
4
通讯作者:
H. Ishida
中科院分区:
文献类型:
--
作者:
M. Yoshikawa;M. Murakami;H. Ishida
The authors developed a noncontact mode scanning near-field Raman microscope (NC-SNORM) with a hollow pyramidal probe, using ultraviolet resonant Raman scattering, measured the stress distribution in very-large-scale integration standards made of silicon dioxide (SiO2) film and Si, and characterized Si nanodot structures. The authors found that the areas covered by SiO2 are under tensile stress and the areas not covered by SiO2 are under compressive stress. Compressive stress concentrates on the interface, about 100nm wide, between the covered and noncovered areas. They measured near-field Raman spectra of the Si nanodot structures and found that the Raman intensities change periodically approximately every 100nm.