Fiber Post Etching with Hydrogen Peroxide: Effect of Concentration and Application Time

Fiber Post Etching with Hydrogen Peroxide: Effect of Concentration and Application Time
复制标题

DOI:
10.1016/j.joen.2010.11.037
复制
发表时间:
2011-03-01
影响因子:
4.2
通讯作者:
Marcondes Martins, Luis Roberto
Marcondes Martins, Luis Roberto
中科院分区:
医学2区
文献类型:
--
作者:
Menezes, Murilo de Sousa;Queiroz, Ellyne Cavalcanti;Marcondes Martins, Luis Roberto

文献摘要

被引文献

相似文献

简介:蚀刻对于暴露纤维并使树脂芯与纤维柱能够机械和化学粘合是必要的。本研究评估了过氧化氢的浓度和使用时间对玻璃纤维柱与树脂芯的表面形貌和粘合强度的影响。方法:用 24% 或 50% 过氧化氢蚀刻纤维柱 1、5 或 10 分钟 (n = 10)。未经任何处理的帖子用作对照。蚀刻后,对柱进行硅烷化处理并涂上粘合树脂。将柱子放入模具中以插入自固化树脂芯。将柱/树脂组件连续切成五个梁,并对其进行拉伸粘合强度测试。数据经过双向方差分析和 Tukey 检验(α = 0.05)。使用扫描电子显微镜分析表面形貌。结果:未蚀刻的柱呈现出相对光滑的表面,没有纤维暴露。过氧化氢的应用增加了表面粗糙度并暴露了纤维。所有实验条件都产生相似的粘合强度值,但高于对照组获得的粘合强度值。结论:无论使用时间长短,24% 和 50% 过氧化氢的暴露都会增加树脂与柱的粘合强度。 (杂志,2011 年结束;37:398-402)
Introduction: Etching is necessary to expose the fibers and enable both mechanical and chemical bonding of the resin core to the fiber post. This study evaluated the effect of concentration and application time of hydrogen peroxide on the surface topography and bond strength of glass fiber posts to resin cores. Methods: Fiber posts were etched with 24% or 50% hydrogen peroxide for 1, 5, or 10 min (n = 10). Posts without any treatment were used as a control. After etching, the posts were silanated and adhesive resin was applied. The posts were positioned into a mold to allow a self-cured resin core to be inserted. The post/resin assembly was serially sectioned into five beams that were subjected to a tensile bond strength test. Data were subjected to two-way ANOVA and Tukey test (alpha = 0.05). The surface topography was analyzed using scanning electronic microscopy. Results: Non-etched post presents a relatively smooth surface without fiber exposure. Application of hydrogen peroxide increased the surface roughness and exposed the fibers. All experimental conditions yielded similar bond strength values that were higher than those obtained in the control group. Conclusion: Both 24% and 50% hydrogen peroxide exposure increased the bond strength of resin to the posts, irrespective of the application time. (J Ended 2011;37:398-402)