Electrical conductivity of a bulk metallic glass composite
Electrical conductivity of a bulk metallic glass composite
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DOI：
10.1063/1.2795800
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发表时间：
2007-10
影响因子：
4
通讯作者：
K. Wang;T. Fujita;Mingwei Chen;T. Nieh;H. Okada;K. Koyama;W. Zhang;A. Inoue
中科院分区：
文献类型：
--
作者：
K. Wang;T. Fujita;Mingwei Chen;T. Nieh;H. Okada;K. Koyama;W. Zhang;A. Inoue
本文报道了由气体雾化玻璃粉和韧性α-黄铜粉的混合粉末温挤压制备的块体金属玻璃基复合材料的导电性能。BMG复合材料的电导率可以很好地用逾渗理论来模拟，高导电黄铜相的临界逾渗阈值体积估计为10%左右。发现短的不规则黄铜纤维可以显著降低BMG的电阻率，从而导致具有高强度和良好导电性的改进材料用于功能应用。
The authors report the electrical conductivity of a bulk metallic glass (BMG) based composite fabricated by warm extrusion of a mixture of gas-atomized glassy powders and ductile α-brass powders. The conductivity of the BMG composite can be well modeled by the percolation theory and the critical percolation threshold volume of the high-conductive brass phase was estimated to be about 10%. It was found that the short irregular brass fibers can dramatically reduce the resistivity of the BMG, leading to an improved material with both high strength and good conductivity for functional applications.