Peel-strength behavior of bilayer thermal-sprayed polymer coatings
Peel-strength behavior of bilayer thermal-sprayed polymer coatings
复制标题
双层热喷涂聚合物涂层的剥离强度行为
DOI:
10.1002/app.11648
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发表时间:
2003
影响因子:
3
通讯作者:
C. Berndt
中科院分区:
文献类型:
--
作者:
Fengyuan Yan;K. Gross;G. Simon;C. Berndt
We prepared various bilayer polymer coat- ings of ethylene methacrylic acid (EMAA) copolymer and ionomer by the thermal-spray process under a range of preheat temperatures (PTs) to investigate their ability to be repaired. The thermal properties, crystallinity, microstruc- ture, and interface strength of the coatings were investigated with differential scanning calorimetry, X-ray diffraction, scanning electron microscopy, and mechanical testing. Pro- cessing parameters influenced the final morphological struc- ture of the coatings. The crystallinity of the coatings in- creased with a higher final temperature, whereas the coating density decreased. The decrease in density was attributed to the appearance of bubbles, 250 m in size, formed in the coatings during the spray process. For the monolayer coat- ing of polymer on a metal substrate, a higher PT produced a greater contact area of the coating to the substrate. The adhesion of EMAA ionomer to steel was always lower than that of EMAA copolymer to steel. This may have been largely due to the interfacial adhesion between the polymer and steel being dominated by strong secondary bond inter- actions. Experimental results also indicate that the peel strength between polymers was at least twofold stronger than that between the polymer and the steel substrate for PTs greater than 100°C. The mixed bilayer coating of iono- mer on copolymer produced the highest peel strength. The interface between the plastic layers was clearly visible under the scanning electron microscope at lower PTs, becoming more diffuse with an increase in PT. On the basis of these observations, the adhesion mechanism between polymers was explained by the formation of welding points. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 214 -226, 2003