Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction
Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction
复制标题
采用非接触感应化学镀镍在 Au 上制造小特征尺寸的 Ni 微凸块
DOI：
10.1109/tcpmt.2015.2448683
复制
发表时间：
2015-08-01
影响因子：
2.2
通讯作者：
Wang, Zheyao
中科院分区：
文献类型：
--
作者：
Du, Yuxin;Song, Zhen;Wang, Zheyao
本文报道了一种新开发的非接触感应化学镀镍（ENPNI）技术在金（Au）表面制备小尺寸镍微凸点的方法。与传统接触感应化学镀镍技术（ENPCI）不同，该技术直接将活性金属与非活性金属连接，诱导Ni电化学反应，其特点是活性金属与目标金属分离。用双电层理论解释了ENPNI的机理，并对一些现象进行了解释。利用ENPNI成功制备了直径为3 ~ 6 μm、高度为3 ~ 4 μm的Ni微凸起。测量了Ni微凸点的电阻，并对其良率和均匀性进行了评价。通过打破接触限制，ENPNI具有不需要预处理和接触感应的优点，允许制造具有小特征尺寸的微凸点，用于不可能直接接触有源感应金属的应用。
This paper reports a method of fabrication for small-feature-sized nickel (Ni) microbumps on gold (Au) using a newly developed technique called electroless Ni plating with noncontact induction (ENPNI). This technique, differing from conventional electroless Ni plating with contact induction (ENPCI), which directly connects an active metal with an inactive metal to induce Ni electrochemical reaction, is characterized by separation of the active metal and the target metal. The mechanism of ENPNI is interpreted by employing the electric-double layer theory, and some phenomena are explained by the proposed mechanism. Ni microbumps with a diameter of 3-6 μm and a height of 3-4 μm have been successfully fabricated using ENPNI. The resistance of the Ni microbumps is measured, and yield and uniformity are evaluated. By breaking the restriction of contact, ENPNI has the advantages of no need for pretreatment and contact induction, allowing fabrication of microbumps with small feature sizes for applications in which direct contact of an active induction metal is impossible.