X-ray based methods for non-destructive testing and material characterization
X-ray based methods for non-destructive testing and material characterization
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DOI：
10.1016/j.nima.2008.03.016
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发表时间：
2008-06-11
影响因子：
1.4
通讯作者：
Uhlmann, Norman
中科院分区：
文献类型：
--
作者：
Hanke, Randolf;Fuchs, Theobald;Uhlmann, Norman
新材料以及微生产领域日益复杂化和小型化，同样要求微无损检测领域的改进和技术进步，以提供关于微组件内部结构的更好质量的数据和更详细的知识。因此，射线检查、超声波、光学或热成像等无损方法对于材料表征、生产控制或模块可靠性测试等不同阶段的持续产品和材料开发越来越重要。由于多种不同的应用领域，即某些物理 NDT 方法应用于材料检验、表征或可靠性测试，本文将重点关注与其最重要应用相关的基于射线的方法。如今，在现代工业质量控制中，X 射线传输以两种不同的方式使用：二维射线透射成像（投影技术），通常应用于轻质材料生产、电子元件焊接或食品生产等应用领域的在线检查任务。计算机断层扫描 (CT) 用于生成三维数据，表示物体的空间信息和密度分布。 CT应用领域一方面是对生产过程故障或组件和模块检查（完整性）的了解，另一方面是隐藏几何轮廓的尺寸测量（计量学）。本文演示了包括技术设置（X射线源和探测器）、成像和重建结果以及高速、高分辨率体积数据生成和评估的方法。 (c) 2008 Elsevier B.V. 保留所有权利。
The increasing complexity and miniaturization in the field of new materials as well as in micro-production requires in the same way improvements and technical advances in the field of micro-NDT to provide better quality data and more detailed knowledge about the internal structures of micro-components.Therefore, non-destructive methods like radioscopy, ultrasound, optical or thermal imaging increasingly gain in importance with respect to ongoing product and material development in the different phases like material characterization, production control or module reliability testing. Because of the manifold different application fields, i.e., certain physical NDT methods applied to material inspection, characterization or reliability testing, this contribution will focus on the radioscopic-based methods related to their most important applications.Today, in modern industrial quality control, X-ray transmission is used in two different ways:Two-dimensional radioscopic transmission imaging (projection technique), usually applied to inline inspection tasks in application fields like lightweight material production, electronic component soldering or food production.Computed tomography (CT) for generation of three-dimensional data, representing spatial information and density distribution of objects. CT application fields Eire on the one hand the understanding of production process failure or component and module inspection (completeness) and on the other hand the dimensional measuring of hidden geometrical outlines (metrology).This paper demonstrates the methods including technical set-ups (X-ray source and detector), imaging and reconstruction results and the methods for high speed and high-resolution volume data generation and evaluation. (c) 2008 Elsevier B.V. All rights reserved.