Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization
Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization
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DOI:
10.1109/vlsi-dat52063.2021.9427353
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发表时间:
2021-04
期刊:
影响因子:
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通讯作者:
M. Kabir;Weishiun Hung;Tsung-Yi Ho;Yarui Peng
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文献类型:
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作者:
M. Kabir;Weishiun Hung;Tsung-Yi Ho;Yarui Peng
In recent days, 2.5D package designs have gained popularity with an increasing number of heterogeneous chiplets integrated into advanced system-in-packages. RDL wires become longer and denser, presenting a growing impact on system performance, reliability, and integrity. At present, there exists no standard CAD flow that can design, analyze, and optimize a complete heterogeneous 2.5D system. The traditional die-by-die design approach processes each component independently during extraction and optimization and cannot be applied to heterogeneous systems without fundamental changes in standard CAD tools. Not only the chiplet-package extraction is inaccurate between the die-package interface ignoring all RDL capacitive and inductive impacts, but traditional CAD tools are also unable to perform cross-boundary design optimization.(p/)(p)We present a complete chiplet-package co-optimization flow for both homogeneous and heterogeneous 2.5D designs. It encompasses 2.5D-aware partitioning, chiplet-package co-planning, holistic and in-context extraction, package inductance consideration, and iterative optimization, along with design analysis and verification of the entire 2.5D system. In our previous work [1] targeting heterogeneous systems, we achieved an extraction error ranging between -2.10% and 24.0%. The in-context design flow proposed in this work achieves less than 1% extraction error on ground and coupling capacitance. This extraction result can be used to perform timing analysis with 99.8% accuracy and to generate timing context with 99.4% accuracy for iterative optimization.