A 146.7 GHz Transceiver with 5 GBaud Data Transmission using a Low-Cost Series-Fed Patch Antenna Array through Wirebonding Integration
A 146.7 GHz Transceiver with 5 GBaud Data Transmission using a Low-Cost Series-Fed Patch Antenna Array through Wirebonding Integration
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通过引线键合集成使用低成本串联馈电贴片天线阵列实现 5 GBaud 数据传输的 146.7 GHz 收发器
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发表时间：
2020
期刊：
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通讯作者：
M. Rodwell
中科院分区：
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作者：
A. Simsek;Seong;M. Abdelghany;Ahmed S. H. Ahmed;A. Farid;Upamanyu Madhow;M. Rodwell
我们提出了一个完全封装的双通道发射机和一个完全封装的四通道接收机使用以前报道的四通道收发器，设计在45 nm CMOS SOI。我们首先提出一个低成本的天线和封装技术，以整合与收发器。8-在IsolaAstraMT 77（${mathcal{E}_r} = 3$，tan δ =0.0017）印刷电路板（PCB）上制造的元件串联馈电线性微带贴片天线阵列显示出13.6dB增益、9° E平面和65° H平面3-dB波束宽度以及7 GHz带宽（S21），接近于模拟。这些天线通过引线键合连接到CMOS多通道发射器和接收器IC。该接口的模拟预测，IC天线球键合（直径20 μm，长度250 μm）中的损耗为1.8 dB，键合焊盘和天线馈电点之间的~1.5 mm PCB微带线中的损耗为0.7 dB。使用这些发射器和接收器板的一个通道，我们演示了在25 cm空气中的5 GBaud BPSK无线数据传输，在146.7 GHz载波频率下具有3 × 10 -5的误码率（BER）和19 dB的信噪比（SNR）。
We present a fully-packaged two-channel transmitter and a fully-packaged four-channel receiver using previously reported four-channel transceivers, designed in 45 nm CMOS SOI. We first present a low -cost antenna and packaging technologies to integrate with the transceivers. 8-element series-fed linear microstrip patch antenna arrays fabricated on an Isola Astra MT77 (${mathcal{E}_r} = 3$, tanℽ=0.0017) printed circuit board (PCB) showed 13.6 dB gain, 9° E- plane and 65° H-plane 3-dB beam-widths, and 7 GHz bandwidth (S21), close to simulation. These antennas are connected to CMOS multi-channel transmitter and receiver ICs through wirebonding. Simulations of this interface predict 1.8 dB loss in the IC-antenna ball-bonds (20 μm diameter, 250 μm length) and 0.7 dB loss in the ~1.5 mm PCB microstrip line between the bond pads and the antenna feed point. Using one channel of these transmitter and receiver boards, we demonstrate 5 GBaud BPSK wireless data transmission over 25 cm air with 3x10-5 bit-error- rate (BER) and 19 dB signal - to-noise-ratio (SNR) at 146.7 GHz carrier frequency.