Pyrolysis treatment of nonmetal fraction of waste printed circuit boards: Focusing on the fate of bromine
Pyrolysis treatment of nonmetal fraction of waste printed circuit boards: Focusing on the fate of bromine
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废印刷电路板非金属部分的热解处理：关注溴的去向
DOI：
10.1177/0734242x19894621
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发表时间：
2020-01
影响因子：
3.9
通讯作者：
Zhitong Yao
中科院分区：
文献类型：
--
作者：
Jingjing Xiong;Shaoqi Yu;Daidai Wu;Xiaoshu Lü;Junhong Tang;Weihong Wu;Zhitong Yao
电子垃圾的高级热处理具有体积减小和能量回收的优点。本文研究了废印刷电路板非金属组分的热解行为。进一步探讨了废印刷电路板非金属组分的溴的归宿和热分解途径。热重分析表明，最大质量损失温度在319℃和361℃，质量损失分别为29.6%和50.6%。傅里叶变换红外光谱分析表明，300°C - 400°C温度下的光谱复杂，吸光度较大。在600°C - 1000°C的温度范围内，废印刷电路板的非金属组分分解剧烈，产物较多。气相色谱-质谱分析表明，除CH4、H2O、CO等小分子外，还生成了多种溴化衍生物。CH4和H2O的释放强度随温度升高而增大，在600℃- 800℃和400℃- 600℃时达到最大值。与HBr和甲基溴（CH3Br）相比，生成了更多的溴乙烷（C2H5Br）。溴丙烷（C3H7Br）和溴丙酮（C3H5BrO）的释放强度虽然小于溴丙烯（C3H5Br），但具有可比性。在热处理过程中，二溴苯酚（C6H4Br2O）的释放量大于溴苯酚（C6H5BrO）。在加热过程中，部分醚键首先断裂形成双酚A、丙醇和四溴双酚A，四溴双酚A分解成C6H5BrO和HBr，再与小分子反应生成溴化衍生物。这意味着废印刷电路板或热解产物的非金属原料馏分应采用脱溴法进行环保处理。
Advanced thermal treatment of electronic waste offers advantages of volume reduction and energy recovery. In this work, the pyrolysis behaviour of nonmetallic fractions of waste printed circuit boards was studied. The fate of a bromine and thermal decomposition pathway of nonmetallic fractions of waste printed circuit boards were further probed. The thermogravimetric analysis showed that the temperatures of maximum mass loss were located at 319°C and 361°C, with mass loss of 29.6% and 50.6%, respectively. The Fourier transform infrared Spectroscopy analysis revealed that the spectra at temperatures of 300°C–400°C were complicated with larger absorbance intensity. The nonmetallic fractions of waste printed circuit boards decomposed drastically and more evolved products were detected in the temperature range of 600°C–1000°C. The gas chromatography–mass spectrometry analysis indicated that various brominated derivates were generated in addition to small molecules, such as CH4, H2O and CO. The release intensity of CH4 and H2O increased with temperature increasing and reached maximum at 600°C–800°C and 400°C–600°C. More bromoethane (C2H5Br) was formed as compared with HBr and methyl bromide (CH3Br). The release intensity of bromopropane (C3H7Br) and bromoacetone (C3H5BrO) were comparable, although smaller than that of bromopropene (C3H5Br). More dibromophenol (C6H4Br2O) was released than that of bromophenol (C6H5BrO) in the thermal treatment. During the thermal process, part of the ether bonds first ruptured forming bisphenol A, propyl alcohol and tetrabromobisphenol A. Then, the tetrabromobisphenol A decomposed into C6H5BrO and HBr, which further reacted with small molecules forming brominated derivates. It implied debromination of raw nonmetallic fractions of waste printed circuit boards or pyrolysis products should be applied for its environmentally sound treating.
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