Crack healing induced electrical and mechanical properties recovery in a Ti2SnC ceramic
Crack healing induced electrical and mechanical properties recovery in a Ti2SnC ceramic
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Ti2SnC 陶瓷中的裂纹愈合诱导电气和机械性能恢复
DOI：
10.1016/j.jeurceramsoc.2015.09.019
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发表时间：
2016-01-01
影响因子：
5.7
通讯作者：
Greil, Peter
中科院分区：
文献类型：
--
作者：
Li, Shibo;Bei, Guoping;Greil, Peter
陶瓷能够通过引发局部烧结（内部裂纹）或氧化反应（表面裂纹）来治愈裂纹和缺陷，这可能会导致机械强度的恢复。然而，陶瓷中的裂纹愈合仅限于微小尺寸的裂纹，并且需要高温（1000 摄氏度以上）和长时间甚至长达 100 小时。在这项工作中，我们报告了 Ti2SnC 陶瓷的加速裂纹愈合，该陶瓷能够在 800 摄氏度的相对较低温度下仅 1 小时内修复热冲击引起的裂纹。愈合处理后，在淬火后对受损材料测量的低弯曲强度和电导率几乎完全恢复。此外，Ti2SnC 具有可重复的修复能力，这为开发在恶劣热条件下延长使用寿命的耐用陶瓷提供了巨大的潜力。 (C) 2015 Elsevier Ltd. 保留所有权利。
Ceramics are able to heal cracks and flaws by triggering local sintering (internal cracks) or oxidation reaction (surface cracks) which may induce the recovery of mechanical strength. Crack healing in ceramics, however, is limited to micro-sized cracks and requires elevated temperatures (above 1000 degrees C) and long time periods even up to 100 h. In this work we report on accelerated crack healing of a Ti2SnC ceramic which is capable to repair thermal shock induced cracks at a relatively low temperature of 800 degrees C within only 1 h. After healing treatment both the low flexural strength and electrical conductivity measured on the damaged material after quenching were almost fully recovered. Furthermore, Ti2SnC exhibits repeatable healing capability which offers a high potential for developing durable ceramics with prolonged lifetime under harsh thermal conditions. (C) 2015 Elsevier Ltd. All rights reserved.