A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications
A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications
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DOI：
10.1109/jssc.2011.2118110
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发表时间：
2010-10
影响因子：
5.4
通讯作者：
A. Natarajan;S. Reynolds;Ming-Da Tsai;S. Nicolson;J. Zhan;D. Kam;Duixian Liu;Y. Huang;A. Valdes-Ga
中科院分区：
文献类型：
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作者：
A. Natarajan;S. Reynolds;Ming-Da Tsai;S. Nicolson;J. Zhan;D. Kam;Duixian Liu;Y. Huang;A. Valdes-Ga
采用IBM0.12-μm SiGe BiCMOS工艺实现了一个全集成的16单元60 GHz相控阵接收机。该接收机采用射频路径移相，适用于60 GHz ISM频段(IEEE802.15.3c和802.11ad)的多Gb/S非视距链路。每个RF前端包括可变增益LNA和移相器，每个前端都能够以粗/细增益步长360°可变相移(11.25°相位分辨率)从57 GHz到66 GHz。详细分析了接收器阵列设计中的噪声权衡，以激励架构选择。接收机中的有源和无源混合信号合成网络采用差分交叉耦合Gysel功率合成器，减小了合成器的损耗和面积。每个阵列前端具有6.8分贝的噪声系数(在22°C下)，阵列从单输入到输出具有-10分贝至58分贝的可编程增益。16个60 GHz口径耦合贴片天线和RX IC一起封装在多层有机封装和LTCC封装中。封装的RX IC能够在所有四个IEEE 802.15.3c通道(58.32到64.8 GHz)中运行。波束形成和波束控制测量表明，在50 ns的波束切换时间下，波束形成和波束控制性能良好。使用封装的RX IC演示了5.3 Gb/S OFDM16-QAM和4.5 Gb/S SC 16-QAM链路。使用反射的视线链路(间距约7.8米)和非视距链路(总路径长度约9米)均已被证明具有优于-18分贝的EVM。该16单元接收器功耗为1.8W，芯片面积为37.7mm2。
A fully-integrated 16-element 60-GHz phased-array receiver is implemented in IBM 0.12-μm SiGe BiCMOS technology. The receiver employs RF-path phase-shifting and is designed for multi-Gb/s non-line of sight links in the 60-GHz ISM band (IEEE 802.15.3c and 802.11ad). Each RF front-end includes variable-gain LNAs and phase shifters with each front-end capable of 360° variable phase shift (11.25° phase resolution) from 57 GHz to 66 GHz with coarse/fine gain steps. A detailed analysis of the noise trade-offs in the receiver array design is presented to motivate architectural choices. The hybrid active and passive signal-combining network in the receiver uses a differential cross-coupled Gysel power combiner that reduces combiner loss and area. Each array front-end has 6.8-dB noise figure (at 22°C ) and the array has -10 dB to 58 dB programmable gain from single-input to output. Sixteen 60-GHz aperture-coupled patch-antennas and the RX IC are packaged together in multi-layer organic and LTCC packages. The packaged RX IC is capable of operating in all four IEEE 802.15.3c channels (58.32 to 64.8 GHz). Beam-forming and beam-steering measurements show good performance with 50-ns beam switching time. 5.3-Gb/s OFDM 16-QAM and 4.5 Gb/s SC 16-QAM links are demonstrated using the packaged RX ICs. Both line-of-sight links (~7.8 m spacing) and non-line-of-sight links using reflections (~9 m total path length) have been demonstrated with better than -18 dB EVM. The 16-element receiver consumes 1.8 W and occupies 37.7 mm2 of die area.