Microstructure Evolution and Failure Analysis of an Aluminum-Copper Cathode Conductive Head Produced by Explosive Welding
Microstructure Evolution and Failure Analysis of an Aluminum-Copper Cathode Conductive Head Produced by Explosive Welding
复制标题
爆炸焊接铝铜阴极导电头的组织演变及失效分析
DOI：
10.1007/s11665-017-3055-2
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发表时间：
2017
影响因子：
2.3
通讯作者：
Liang Shuhua
中科院分区：
文献类型：
--
作者：
Wei Yanni;Luo Yongguang;Qu Hongtao;Zou Juntao;Liang Shuhua
本文研究了阴极导电磁头在使用过程中铝铜界面的微观结构演变及失效分析。研究并分析了复合材料的界面形貌、组成、电导率和力学性能。接触界面表面有明显的腐蚀，在Al基体上更为普遍。界面局部冶金结合区裂纹急剧增加，复合体积变化不明显。利用元素组成和x射线衍射图研究了界面在使用过程中发生的相变。界面附近的显微硬度相应增大。使用一段时间后，阴极导电头的Al/Cu界面电导率明显下降。因此，微观组织的恶化和腐蚀是影响电导率和有效结合的主要因素，将导致最终失效。
In this paper, microstructure evolution and failure analysis of the aluminum-copper interface of cathode conductive heads during their use were studied. The interface morphologies, compositions, conductivity and mechanical properties were investigated and analyzed. Obvious corrosion was found on the surface of the contact interface, which was more prevalent on an Al matrix. The crack increased sharply in the local metallurgical bonding areas on the interface, with the compound volume having no significant change. The phase transformation occurred on the interface during use, which was investigated using the elemental composition and x-ray diffraction pattern. The microhardness near the interface increased accordingly. An obvious electrical conductivity decrease appeared on the Al/Cu interface of the cathode conductive head after use over a specific time interval. Therefore, the deterioration of the microstructures and corrosion are the primary factors that affect the electrical conductivity and effective bonding, which will lead to eventual failure.