Second generation of optical IC-backside protection structure
Second generation of optical IC-backside protection structure
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第二代光学IC-背面保护结构
DOI：
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发表时间：
2020
期刊：
影响因子：
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通讯作者：
Jean
中科院分区：
文献类型：
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作者：
E. Amini;T. Kiyan;N. Herfurth;A. Beyreuther;C. Boit;Jean
在片上系统（SoC）技术中，诸如密码密钥的秘密数据存储在芯片上。因此，该系统必须能够保护机密数据免遭未经授权的访问。尽管在芯片的正面实施了许多对策，但缺乏背面保护使得集成电路（IC）容易受到物理和光学攻击。本文旨在进一步阐述一个背面保护结构，已被证明是一个有价值的增强在硬件安全领域。这里提出的第二代背面保护机制提供了增加可用于监视背面攻击的监视数据量的解决方案。通过人工智能（AI）方法分析所获得的数据，我们可以获得有关IC背面和IC结构的详细和准确的信息。获得这些信息有助于改进保护机制。此外，本研究提出在涂覆保护层之前在硅背表面上创建随机粗糙度。介绍了一种利用这种非均匀表面结合所提出的保护机制及其AI数据来实现物理不可克隆功能（PUF）的概念，实现了安全的密钥生成或认证。
In a system-on-chip (SoC) technology, the secret data such as cryptographic keys are stored on the chip. Accordingly, the system must be able to protect confidential data from unauthorized access. Despite the existence of numerous countermeasures that are implemented on the frontside of the chip, a lack of backside protection makes the integrated circuit (IC) vulnerable to physical and optical attacks. This paper aims to elaborate further on a backside protection structure that had proven as a valuable enhancement in the field of hardware security. The here presented second-generation of a backside protection mechanism provides solutions to increase the amount of monitoring data that can be used to monitor a backside attack. Through analyzing the obtained data by artificial intelligence (AI) approach, we can get detailed and accurate information about the IC backside and IC structures. Gaining this information helps to improve the protection mechanism. Furthermore, this study proposes to create a random roughness on the silicon back surface before coating a protection layer. A concept to use such an inhomogeneous surface in combination with the presented protection mechanism and its AI data to realization physical unclonable functions (PUF) is introduced, realizing a secure key generation or authentication.