Microprobe array with electrical interconnection for thermal imaging and data storage
Microprobe array with electrical interconnection for thermal imaging and data storage
复制标题
用于热成像和数据存储的具有电气互连的微探针阵列
DOI：
10.1109/jmems.2002.1007400
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
M. Esashi
中科院分区：
文献类型：
--
作者：
Dong;T. Ono;T. Abe;M. Esashi
在这项工作中，提出了在一块芯片上制作32个/SPL次数/32个探针的热探针阵列的新方法。它由硅微机械探头、氮化铝驱动器、金字塔形SiO/Sub2/TiP组成，利用自对准技术在其上形成了纳米级的金属-金属结。纳米结可以用作热电偶测量样品表面的局部温度，或用作纳米加热器在介质上进行局部变形。利用所制作的热探头，测量了所制备样品表面的温度分布，证实了热探头的局部加热能力。在相变介质上进行数据写入和读取的初步实验。
In this work, new novel methods for fabricating a thermal probe array with 32 /spl times/ 32 probes on one chip are proposed. It consists of silicon micromachined probe, AlN actuator, pyramidal SiO/sub 2/ tip on which the nano-scale metal-metal junction is formed using a self-alignment technique. The nano-junction can be used as a thermocouple to measure a local temperature on a sample surface or as a nano-heater to make a local deformation on a media. Using the fabricated thermal probe, temperature distribution is measured on a prepared sample surface and the local heating capability of the thermal probe is confirmed. Preliminary experiments for data writing and reading are performed on a phase change medium.