From chip to cooling tower data center modeling: Part II Influence of chip temperature control philosophy
From chip to cooling tower data center modeling: Part II Influence of chip temperature control philosophy
复制标题
从芯片到冷却塔数据中心建模：第二部分芯片温度控制理念的影响
DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
C. Bash
中科院分区：
文献类型：
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作者：
E. Walsh;T. J. Breen;J. Punch;Amip Shah;C. Bash
冷水机冷却的数据中心环境由许多相互关联的元素组成，这些元素通常被视为单独的组件。在确定寻求提高效率的任何数据中心设计和运营策略（例如温度控制风扇算法）的好处时，必须考虑这一系列组件及其相互影响。本文使用本工作第一部分中开发的模型，通过考虑处理器散热器温度，将分析扩展到包括机架内的电子设备。这使得可以确定各种冷却策略对数据中心性能系数的影响。对提高入口通道温度的策略进行了一些详细的研究，发现这并不是提高数据中心整体能源性能的可靠方法，而芯片级的严格温度控制始终提供更好的性能，每瓦冷却功率产生更多的计算量。这些发现对于机架级风扇控制算法的设计和数据中心的一般操作策略具有很强的实际意义。最后，考虑了散热器热阻的影响，并讨论了改进散热器设计所带来的潜在数据中心效率增益。
The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other must be considered in determining the benefits of any data center design and operational strategies seeking to improve efficiency, such as temperature control fan algorithms. Using the models developed in part I of this work, this paper extends the analysis to include the electronics within the rack through considering the processor heat sink temperature. This has allowed determination of the influence of various cooling strategies on the data center coefficient of performance. The strategy of increasing inlet aisle temperature is examined in some detail and found not to be a robust methodology for improving the overall energy performance of the data center, while tight temperature controls at the chip level consistently provides better performance, yielding more computing per watt of cooling power. These findings are of strong practical relevance for the design of fan control algorithms at the rack level and general operational strategies in data centers. Finally, the impact of heat sink thermal resistance is considered and the potential data center efficiency gains from improved heat sink designs are discussed.