Deterministic Assembly of Arrays of Lithographically Defined WS2 and MoS2 Monolayer Features Directly From Multilayer Sources Into Van Der Waals Heterostructures
Deterministic Assembly of Arrays of Lithographically Defined WS2 and MoS2 Monolayer Features Directly From Multilayer Sources Into Van Der Waals Heterostructures
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DOI：
10.1115/1.4045259
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发表时间：
2019-11
影响因子：
1
通讯作者：
Vu Nguyen;H. Gramling;Clarissa M. Towle;Wan Li;D. Lien;Hyungjin Kim;D. Chrzan;A. Javey;Ke Xu;J. Ager;H. Taylor
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文献类型：
--
作者：
Vu Nguyen;H. Gramling;Clarissa M. Towle;Wan Li;D. Lien;Hyungjin Kim;D. Chrzan;A. Javey;Ke Xu;J. Ager;H. Taylor
二维（2D）材料的货车德瓦尔斯（vdW）集成中的主要挑战之一是实现预定义的单层序列到异质结构阵列中的高产率和高通量组装。机械剥离最近已被研究作为一种有前途的技术，从其他技术合成的多层源转移单层，允许各种各样的2D材料的沉积，而不暴露的目标基板苛刻的合成条件。虽然已经开发了各种工艺来从源机械地剥离2D材料并将它们确定性地放置到目标衬底上，但是它们通常一次只能转移晶片级毯或一个小薄片，具有不受控制的尺寸和形状。在这里，我们提出了一种方法来组装阵列的光刻定义的单层WS 2和MoS 2功能从多层源，并直接将它们以确定性的方式转移到目标基板上。这种剥离-对准-释放过程-无需中间载体基底-通过将图案化的金介导的剥离技术与新的光学透明的热释放粘合剂相结合来实现。用这种方法制备的WS 2/MoS 2 vdW异质结阵列显示出预期的单层间层间激子。还展示了使用WS 2单层的发光器件，证明了所制造材料的功能性。我们的工作表明了一个重要的一步，发展机械剥离作为一个可扩展的干转移技术的功能，原子级薄材料的制造。
One of the major challenges in the van der Waals (vdW) integration of two-dimensional (2D) materials is achieving high-yield and high-throughput assembly of predefined sequences of monolayers into heterostructure arrays. Mechanical exfoliation has recently been studied as a promising technique to transfer monolayers from a multilayer source synthesized by other techniques, allowing the deposition of a wide variety of 2D materials without exposing the target substrate to harsh synthesis conditions. Although a variety of processes have been developed to exfoliate the 2D materials mechanically from the source and place them deterministically onto a target substrate, they can typically transfer only either a wafer-scale blanket or one small flake at a time with uncontrolled size and shape. Here, we present a method to assemble arrays of lithographically defined monolayer WS2 and MoS2 features from multilayer sources and directly transfer them in a deterministic manner onto target substrates. This exfoliate–align–release process—without the need of an intermediate carrier substrate—is enabled by combining a patterned, gold-mediated exfoliation technique with a new optically transparent, heat-releasable adhesive. WS2/MoS2 vdW heterostructure arrays produced by this method show the expected interlayer exciton between the monolayers. Light-emitting devices using WS2 monolayers were also demonstrated, proving the functionality of the fabricated materials. Our work demonstrates a significant step toward developing mechanical exfoliation as a scalable dry transfer technique for the manufacturing of functional, atomically thin materials.